Surface mount technology is the method of attaching both leaded and non-leaded electrical components to the surface of a conductive pattern that does not utilize leads in feed through holes. It is an innovative trend in the field of Printed Circuit. Printed circuit board designing especially those requiring high on board density. This seminar
A good reference: Surface Mount Technology by Prasad (ITP) Page 18 Paste and printing Solder paste has tiny metal spheres of the alloy mixed with flux, solvents, and thixotropic materials Methods of applying solder paste: • Stencil printing • Syringe dispensing Most influential step affecting yield. Page 19
90 SURFACE MOUNT TECHNOLOGY 91 INTRODUCTION TO SMT A new packaging technique, not a new technology, that’s forever changing the way that we build electronics circuits. 98 HAND SOLDERING Soldering SMC’s is easy, once you know how! 99 SMT PROJECT: LED FLASHER An attention -grabber that’s smaller than a postage stamp. 101 …
1.2 Types of Surface Mount Technology . SMT replaces DIP’s with surface mount components. The assembly is soldered by reflow and/or wave soldering processes depending on the mix of surface mount and through-hole mount components. When attached to PB’s, both active and passive SMC’s form three major
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Surface mount technology changes rapidly . However, trends can be identified. This book includes my observations of industry trends. By understanding these trends, you will gain a fuller appreciation of the components described in this book. They will begin to take on a life of their own and will become more meaningful to you than just names on …